ligitek electronics co.,ltd. property of ligitek only pb lead-free parts lsbi2640/l5 round type led lamps data sheet doc. no : qw0905-lsbi2640/l5 rev. : a date : 18 - oct. - 2006
0.5 typ 35.0min 2.54typ 1.0min 3.3 4.3 1.5max 2.9 3.1 ligitek electronics co.,ltd. property of ligitek only package dimensions 1/5 page lsbi2640/l5 part no. + - note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 30 directivity radiation -30 0 100% 75% 25%50% 0 25% 50% 100% 75% -60 60
page 2/5 unit sbi ratings ligitek electronics co.,ltd. property of ligitek only ma mw ma a v 30 120 70 i f pd i fp 50 500 ir t opr esd -20 ~ +80 tstg -30 ~ +100 viewing angle 2 1/2 (deg) luminous intensity @20ma(mcd) 21 12 typ. min. dominant wave length dnm spectral halfwidth nm 3.8 65 465 typ. max. 4.7 forward voltage @20ma(v) parameter peak forward current duty 1/10@10khz forward current reverse current @5v electrostatic discharge( * ) power dissipation operating temperature storage temperature material blue ingan/sic emitted lsbi2640/l5 part no color lens symbol absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) blue diffused 50 peak wave length pnm 430 static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * lsbi2640/l5 part no.
100 45 fig.5 forward current vs. ambient temperature fig.3 relative intensity vs. forward current 5 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve f o r w a r d c u r r e n t ( m a d c ) 10 0 0 20 30 ambient temperature ( ) 50 2575 r e l a t i v e i n t e n s i t y ( % ) 40 0 0 5 25 forward current (ma dc) 15 10 2035 30 40 50 25 75 125 100 20 f o r w a r d c u r r e n t ( m a d c ) 0 1 5 10 15 forward voltage(v) 2 3 4 30 25 sbi chip r e l a t i v e i n t e n s i t y lead temperature ( ) 0 025 50 75 100 fig.4 relative intensity vs. lead temperature 1 10 3/5 page r e l a t i v e i n t e n s i t y ( % ) 480 wavelength (nm) 380 0 430 0.5 630 530 580 680 fig.2 relative intensity vs. wavelength 1.0 ligitek electronics co.,ltd. property of ligitek only lsbi2640/l5 part no.
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 4/5 0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max 60 seconds max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. lsbi2640/l5 part no.
ligitek electronics co.,ltd. property of ligitek only reference standard jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. operating life test low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. page 5/5 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. high temperature high humidity test thermal shock test this test intended to see soldering well performed or not. 1.t.sol=230 5 2.dwell time=5 1sec solderability test 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. lsbi2640/l5 part no.
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